| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device, which is capable of relaxing stress produced at the corners of an IC chip. <P>SOLUTION: A wafer W1 is diced along scribe lines into rectangular IC chips 1, and then the diced ICs are chamfered and formed into columnar or polygonal (pentagonal or more) IC chips 2 to 4 through machining. The polygonal columnar IC chips 2 to 4 (columnar or pentagonal or more) are mounted on a lead frame and sealed up with molding resin for packaging. <P>COPYRIGHT: (C)2004,JPO |
