| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device of the WCSP (wafer-level chip size package) type wherein impedance is aligned between the circuit elements belonging in a semiconductor chip and the rerouted wiring layer which is a signal line electrically connected to the circuit elements. <P>SOLUTION: The semiconductor device with the package therefor similar in outer dimensions to a semiconductor chip 15 mounted with circuit elements has a plurality of electrode pads 20 (20a, 20b) provided on the semiconductor chip 15; an insulating layer 32 provided on the semiconductor chip 15 with the electrodes 20 exposed therein; a plurality of external terminals 45 provided on the upper surface of the insulating layer 32 but not at positions just above the electrode pads 20; and a plurality of wiring layers 35 provided on the insulating layer 32 for electrically connecting the electrode pads 20 with the external terminals 45, respectively. The wiring layers 35 include first wiring layers 35a to serve as ground lines and a second wiring layer 35b to serve as a signal line, with the second wiring layer 35b sandwiched between the first layers 35a. <P>COPYRIGHT: (C)2004,JPO |
