PHOTOSENSITIVE RESIN COMPOSITION, RELIEF PATTERN USING THE SAME, METHOD FOR MANUFACTURING HEAT-RESISTANT COATING FILM, AND ELECTRONIC PART HAVING THESE COMPONENTS

摘要

PROBLEM TO BE SOLVED: To provide a photosensitive resin composition containing an amine imide as a photobase generating agent which efficiently generates an enough strong base even with low exposure, together with a polyoxazole precursor, and to provide a method for manufacturing a relief pattern and a method for manufacturing a heat-resistant coating film.

SOLUTION: The photosensitive resin composition contains (a) an amine imide compound which generates the base by irradiation of active rays, and (b) a polyoxazole precursor. The method for manufacturing a relief pattern includes a process of irradiating a coating film made of the photosensitive resin composition with active rays in a pattern, heating the film at 50 to 80°C, and then developing and removing the portion not irradiated. The method for manufacturing the heat-resistant coating film includes a process of irradiating a coating film made of the photosensitive resin composition with active rays all over the surface, and then heating the film at 80 to 350°C. The electronic parts have the heat-resistant coating film or a heat-resistant insulating pattern as a surface protective layer or an interlayer insulating layer.

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