发明名称 PHOTO-CURABLE TYPE RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a photo-curable type resin composition having a good low temperature curing property, excellent in photosensitivity, rapid curing property, humidity permeation resistance and adhesion, having low adhering strength and low elastic modulus, also having good productivity, and capable of being used for a flat panel such as a liquid crystal, an electroluminescence display, etc. SOLUTION: This photo-curable type resin composition is characterized by containing each specific amount of (a) a compound having at least one group expressed by formula: CH<SB>2</SB>=C(X)-COOCH<SB>2</SB>-CH(OH)- (wherein, X is H or methyl) in its molecule, (b) a urethane acrylate, (c) 2-hydroxyethyl methacrylate or 2-hydroxyethyl acrylate, (d) a silane coupling agent and (e) a polymerization initiator. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004075934(A) 申请公布日期 2004.03.11
申请号 JP20020240970 申请日期 2002.08.21
申请人 SHIN ETSU CHEM CO LTD 发明人 SHIMIZU HISASHI;KASHIWAGI TSUTOMU
分类号 C08F290/06;(IPC1-7):C08F290/06 主分类号 C08F290/06
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