发明名称 HEAT-CONDUCTIVE RESIN COMPOSITION AND PHASE-CHANGE TYPE HEAT RADIATION MEMBER
摘要 PROBLEM TO BE SOLVED: To obtain a heat-conductive resin composition which has high thermal conductivity and is thinned and suitable for a heat radiation material for a heat build-up electronic part, and a heat radiation member (phase change). SOLUTION: The heat-conductive resin composition comprises 5-30 mass % of wax having 30-120°C melting point, 5-20 mass % of a resin softening at 30-120°C except waxes and 65-85 mass % of a filler which consists of aluminum nitride and/or alumina powder composed of fine powder (a) having 1-3μm average particle diameter and 3-10μm maximum particle diameter and ultrafine powder (b) having 0.1-0.9μm average particle diameter in the volume ratio of a/b of 7/3-3/7 and has 0.5-1.4μm average particle diameter. The phase-change type heat radiation member comprises molding of the heat-conductive resin composition in a part of at least one side of a metal foil. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004075760(A) 申请公布日期 2004.03.11
申请号 JP20020235485 申请日期 2002.08.13
申请人 DENKI KAGAKU KOGYO KK 发明人 SAWA HIROAKI;MITSUNAGA TOSHIKATSU;KAWANO MASATO;KANEKO MASAHIDE
分类号 B32B15/08;C08K3/22;C08K3/28;C08L91/06;C08L101/00;H01L23/36;H01L23/373;(IPC1-7):C08L91/06 主分类号 B32B15/08
代理机构 代理人
主权项
地址