| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wiring board with bumps having the bumps with uniform volumes or heights, permitting efficient manufacture, and causing no problems such as a short circuit, even if the height is set considerably high in some qualities of materials. <P>SOLUTION: A wiring board with bumps is provided with a substrate 103, and a plurality of bonded bumps that are formed by cutting linear or columnar long bump materials 50 into pillars of a predetermined length in the lengthwise direction and mounting the pillars on the connecting surface of the substrate 103 to bond them onto the connecting surface. In the wiring board 103, the bump materials 50 are cut into the predetermined length, and they are mounted/bonded onto the substrate. Consequently, the bumps are formed, so the variations in the volume or height of the bumps can be restrained small by the cutting length control of the bump materials 50. Moreover, they can be manufactured efficiently even in the case when the number of the bumps is large. <P>COPYRIGHT: (C)2004,JPO |
