| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an adhesive film for an underfill having incorporated a silica fine particle therewith which exhibits excellent relaxing effects on stresses generated in a semiconductor element, a wiring circuit board and a connecting electrode and can form a sealing resin layer ensuring excellent reliability on the semiconductor element, the wiring circuit board and the connecting electrode, and a semiconductor device having formed a sealing resin layer for sealing a vacant space between the semiconductor element and the wiring circuit board using the same. <P>SOLUTION: The adhesive film for an underfill comprises (A) a specific polycarbodiimide copolymer and (B) a silica fine particle having an average particle size of at most 15μm, where the difference of the refractive index between (A) and (B) is within±0.03. The semiconductor device is obtained by sealing the vacant space between the semiconductor element and the wiring circuit board using the adhesive film for an underfill. <P>COPYRIGHT: (C)2004,JPO</p> |
