| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer printed wiring substrate having no defective shape such as a projection or a dent in an end surface and having a via hole of the good quality. SOLUTION: The multilayer printed wiring substrate contains a laminated body consisting of a plurality of insulated layers as a main structure, and comprises the via hole (pillar-like conductor 31a) for electrically connecting conductive circuits of a self-layer or adjacent layer in each of the insulating layers. The via hole is formed by patterning a metal foil 31 having conductivity. Since a height H (dimension in a thickness direction of a via hole formation layer) of the via hole is principally decided by a thickness D of the metal foil 31 as an original material, the via hole can be formed without filling a conductive paste or an electrolytic plating, and the multilayer printed wiring substrate having no defective shape such as a projection or a dent in the end surface and having the via hole of the good quality can be manufactured. COPYRIGHT: (C)2004,JPO |
