| 摘要 |
PROBLEM TO BE SOLVED: To provide a device for manufacturing a semiconductor which can rapidly cool a wafer after heating the wafer in a gas atmosphere. SOLUTION: This device for manufacturing the semiconductor comprises a furnace tube 12, a heating part 44 arranged in the furnace tube, a cooling part 46 arranged in a different position from the heating part in the furnace tube, and a means 32 for transferring the wafer 34 between the heating part and the cooling part. The wafer is heated at the heating part and cooled at the cooling part. COPYRIGHT: (C)2004,JPO |
