| 摘要 |
PROBLEM TO BE SOLVED: To enable a surface state of a semiconductor package to be appropriate satin finish when the semiconductor package is molded with a resin mold. SOLUTION: A release sheet contains at least a release layer bearing release of a semiconductor package molded article and a substrate layer for supporting the release layer. For the release sheet, a surface roughness of the substrate layer Rz is made≥1.0μm. Thereby, when the semiconductor package is molded with a resin mold, the surface state can be appropriate satin finish and wrong reading of a laser marking character can be decreased. COPYRIGHT: (C)2004,JPO |
