发明名称 ETCHANT FOR THIN SILVER ALLOY FILM AND PATTERN FORMATION METHOD USING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide an etchant which can be practically used in forming a pattern, such as of wiring, on a thin silver alloy film with a gold content of 10 atom% or lower. SOLUTION: The etchant is an aqueous solution containing at least one inorganic acid selected from among phosphoric acid, sulfuric acid, and nitric acid, an oxidant containing at least one chemical species corresponding to an electrode reaction with a standard electrode potential of +0.75V or higher, and a surfactant having a plurality of structures of an aromatic sulfonic acid or aromatic sulfonic acid salt in the molecule. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004076103(A) 申请公布日期 2004.03.11
申请号 JP20020238247 申请日期 2002.08.19
申请人 KOBE STEEL LTD 发明人 SUZUKI TETSUO;ADACHI KIYOMI
分类号 C23F1/30;C23F1/00;(IPC1-7):C23F1/30 主分类号 C23F1/30
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