发明名称 Module support for electrical/electronic components
摘要 In a module frame for electronic components, having a conductor structure having a metallic conductor, at least one contact segment of a metallic conductor, the at least one contact segment of the metallic conductor uncovered by the insulation sheathing and conductively connected to a segment of the metallic conductor, the thermal conduction cross section of the at least one connecting web being designed to be so small that when the contact segment is intensely heated, the connecting web has a throttling effect on the heat flow to the segment of the conductor.
申请公布号 US2004047125(A1) 申请公布日期 2004.03.11
申请号 US20030399651 申请日期 2003.10.07
申请人 SCHMID ROLAND;UHLAND THOMAS;BECKBISSINGER KAI;SCHINZEL RALF;HENNEL UDO 发明人 SCHMID ROLAND;UHLAND THOMAS;BECKBISSINGER KAI;SCHINZEL RALF;HENNEL UDO
分类号 H01L23/32;H05K1/02;H05K1/11;H05K3/20;H05K3/34;(IPC1-7):H05K7/20 主分类号 H01L23/32
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