发明名称 FILAMENTARY MATERIAL BUNDLE
摘要 <P>PROBLEM TO BE SOLVED: To provide a filamentary material bundle of low costs and a simple structure by quickening surplus length treatment work of a surplus length part of filamentary material. <P>SOLUTION: Since filamentary material 11 is bundled with designated adhesion, the filamentary material 11 can be pull out from the filamentary material bundle 10 by pulling one end of the filamentary material 11 by a designated force and removing from adhesion of the filamentary material bundle 10. The filamentary material 11 of a necessary length can be used. Since the surplus length part of the filamentary material 11 is bundled in the filamentary material bundle 10, the surplus length part can be easily stored in a small space and construction can be smoothly and quickly executed. <P>COPYRIGHT: (C)2004,JPO
申请公布号 JP2004075226(A) 申请公布日期 2004.03.11
申请号 JP20020234440 申请日期 2002.08.12
申请人 DAIDEN CO LTD 发明人 YAMAGUCHI MASAAKI;MATSUNO AKINARI
分类号 G02B6/00;B65H75/36;H02G3/30 主分类号 G02B6/00
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