| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a highly reliable semiconductor device and its manufacturing method, a circuit board as well as an electronic apparatus. <P>SOLUTION: A semiconductor chip 40, on which a plurality of bumps 30 are formed, is bonded to a wiring board 12, on which a wiring pattern 22 is formed, through face-down bonding employing an adhesive 64 including conductive particles 66. At least one part of the surface of the wiring pattern 22 or the tip end surface of the bumps 30 is provided with irregularities. The conductive particles 66 are interposed between the wiring pattern 22 and the bumps 30. <P>COPYRIGHT: (C)2004,JPO |
