| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a packaging processing apparatus capable of making maintenance/improvement of a product quality compatible with reduction of product costs at a high level by surely avoiding unexpected contact of a packaging component and a component to be packaged while improving productivity. <P>SOLUTION: A contact detection starting position Hs0 is set in S1, and an electronic component 100 is adsorbed to a chip holding tool 101 in S2. The tool 101 is moved to a conveying position A, and the tool 101 is then moved down from the conveying position A to the position Hs0 in S3 and S4. When the tool 101 is moved down to Hs0, a downward moving speed is changed into a contact detecting speed in S5, and it is determined whether or not the electronic component 100 is contacted to a substrate 108 in S6. In the decision of YES, the tool 101 is stopped moving down in S7. A real contact position Hc is detected in S8, and the next contact detection starting position Hs1 is found in S9. Then, Hs1 is set to Hs0 (Hs0←Hs1) to reflect processing after the next one therewith. The electronic component 100 and the substrate 108 are bonded in the ultrasonic manner, and the tool 101 is then conveyed to the conveying position A in S10 and S11. It is determined whether or not stop is instructed in S12. In the case of YES, this flow is ended, but in the case of NO, processing is returned to S2 to repeat bonding processing. <P>COPYRIGHT: (C)2004,JPO |
