| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a substrate positioning device and the positioning method therefor wherein the positioning of a thin substrate, which readily generates warpage, is effected with a high accuracy. <P>SOLUTION: In the substrate positioning device equipped with an attraction table 1 for correcting the warpage of a substrate by attracting the same from the lower surface thereof and at least two sets or more of positioning tops 2 for positioning the substrate by pinching the same on the attraction table 1, rollers 3 (attraction table moving means) for moving the attraction table 1 into XYΘ directions are provided to position the substrate by moving the same integrally with the attraction table 1 into the XYΘ directions by affecting the positioning tops 2 of respective sets on the substrate attracted to the attraction table 1. <P>COPYRIGHT: (C)2004,JPO |
