| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide chip electronics components capable of preventing electrical conductivity between a surface electrode layer and a circuit on a substrate from lowering even if a couple of additional electrode layers are provided. <P>SOLUTION: A couple of the additional electrode layers 15, 15 with smaller electrical conductivity than that of a couple of the surface electrode layers 5, 5 are formed using conductive paste on the surface electrode layer 5, 5 so as to embed a pair of recess portions each formed between part of a couple of side face electrodes 13, 13 and both ends of over coats 9, 11. Each of the couple of the additional electrode layers 15, 15 is formed so that contact surfaces 5a, 5a with which a pair of thin film covered electrodes 21, 21 contact are made to remain on a surface of the couple of the surface electrode layers 5, 5. <P>COPYRIGHT: (C)2004,JPO</p> |
