| 摘要 |
PROBLEM TO BE SOLVED: To provide a memory-module heat radiating device wherein it can cool memory modules efficiently at a low cost in a space saving way, and such works as its attachment and detachment are made easy, and further, it has such a high flexibility as to make it adaptable to the semiconductor memory modules having miscellaneous disposing pitches. SOLUTION: The memory-module heat radiating device is the device interposed between semiconductor memory modules 7, 8 for performing the heat radiations of the semiconductor memory modules 7, 8, when disposing projectively in parallel with each other memory boards. A plurality of memory elements are so provided as to constitute respectively the semiconductor memory modules 7, 8. The memory-module heat radiating device has a thermal conduction component 1 having a thermal conductivity not lower than a predetermined value, and has an elastic component 2 exhibiting such a force that the thermal conduction component 1 abuts thereby against the adjacent semiconductor memory modules 7, 8 to each other. COPYRIGHT: (C)2004,JPO
|
