| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device that can be accommodated in electronic apparatuses required for reduction in size, thickness and in weight. SOLUTION: Chips split from a plurality of semiconductor elements 1 are thinned down to 10 to 90μm and the semiconductor elements thus thinned are rolled. The semiconductor elements 1 thus rolled are put on a mounting substrate 3 so as to be connected electrically via a bump electrode 4, so that a mounting area can be reduced by 50 to 90% compared to a conventional mounting area, thus allowing the semiconductor elements to be accommodated in the electronic apparatuses required for extreme reduction in size. COPYRIGHT: (C)2004,JPO
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