发明名称 HIGH-SPEED BONDING SYSTEM
摘要 PROBLEM TO BE SOLVED: To provide a high-speed bonding system using a bonding fixture to easily form a curved face, using a hot plate having the optimum capacity, shortening the heating and cooling time, improving the production efficiency and giving a product having excellent surface accuracy at a low production cost. SOLUTION: Bonding fixtures 3 are attached to the upper mold Du and the lower mold Dl of a press. The bonding fixture 3 is composed of a plate having a pressing face 2 meeting the curved face or the flat face of the work 1 to be formed as a formed article, i.e. a combination of a comb-shaped longitudinal cross-section and a planar lattice form to form an imaginary plane meeting the shape of the face of the work 1. A hot plate 4 having a laminated structure composed of the 1st and the 2nd metal plates 5a and 5b at the top and bottom and containing a plane heater 6 and a heat-insulator 7 inserted between the plates is attached to the pressing face 2. The bonding of the work 1 can be carried out in a short time. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004075927(A) 申请公布日期 2004.03.11
申请号 JP20020240678 申请日期 2002.08.21
申请人 YOKOHAMA SEIKI KK 发明人 SUDO TOSHIMI;SHIMIZU KIMIO
分类号 C09J5/06;(IPC1-7):C09J5/06 主分类号 C09J5/06
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