METHOD FOR SOLDER-STOP STRUCTURING OF ELEVATIONS ON WAFERS

摘要

PURPOSE: A method for solder-stop structuring of elevations on wafers is provided to simply and reliably produce reliable solder stop and good flank protection of a 3D structure. CONSTITUTION: A resist(11) is deposited on a tip of a 3D(three-Dimensional) structure. Then, a solder stop layer(8) is deposited over the metallization and over the resist(11). The resist(11) on the tip of the 3D structure, including the solder stop layer(8) covering the resist, is subsequently removed so that an Au layer(7) on the tip of the 3D structure is exposed.