CHUCK TABLE FOR SEMICONDUCTOR CHIP PACKAGE MANUFACTURE

摘要

PURPOSE: A chuck table for semiconductor chip package manufacture is provided to perform stably an adhering process by forming a vacuum region between a support member and a middle block. CONSTITUTION: A chuck table for semiconductor chip package manufacture includes the first body(220), the second body(240), a support member(260), and a middle block(280). The first body(220) includes the first vacuum supply hole(222) and a vacuum hole(224) connected to the first vacuum supply hole(222). The second body(240) includes the first insertion hole(242) and the second insertion hole(244) connected to the first insertion hole(242). The support member(260) includes the second vacuum supply holes(262) and a plurality of vacuum holes(264) connected to the second vacuum supply holes(262). The support member(260) is inserted into the second insertion hole of the second body. The middle block(280) is formed with an upper part(281) and a lower part(282). The third vacuum supply holes(286) are formed on the upper part(281). The lower part(282) is combined with a bottom side of the second body by using the second combination members(288).