发明名称 HOLDING DEVICE OF PLATE-LIKE MEMBER, METHOD FOR HOLDING AND SPIN TREATING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a holding device of a plate-like member which supports the member such as, a glass substrate or the like for a semiconductor wafer or a liquid crystal without bringing into contact with its lower surface and which can surely clamp its peripheral edges. SOLUTION: The holding device of the plate-like member includes a rotatably driven rotor 7, a plurality of tilting edges 20 having bearing surfaces 21 provided with a predetermined interval in a circumferential direction of the rotor, tilting toward a radial direction of the rotor and supporting the peripheries of the lower surfaces of the semiconductor wafers U, clamp pins 19 respectively provided near the plurality of the tilting edges, and a drive mechanism 81 for moving the pins in the radial inward of the rotor along the tilting bearing surfaces to hold the edges of the wafers U supported to the edges. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004079637(A) 申请公布日期 2004.03.11
申请号 JP20020235081 申请日期 2002.08.12
申请人 TOSHIBA CORP;SHIBAURA MECHATRONICS CORP 发明人 FURUYA MASAAKI
分类号 B25J15/08;H01L21/027;H01L21/68;H01L21/683;(IPC1-7):H01L21/68 主分类号 B25J15/08
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