| 摘要 |
PROBLEM TO BE SOLVED: To provide a test device of a semiconductor wafer for a high frequency which prevents a chip determined as unacceptable by a DC test to be tested in a plurality of processes. SOLUTION: The test device is so designed that a high frequency test is conducted for a semiconductor wafer for a high frequency based on a theoretical map that indicates which chips are target chips for the high frequency test and which chips are not. The test device is equipped with a means 13 for reading data 12 on a DC test which is conducted prior to the high frequency test, and with a comparison means 14 for comparing the data 12 with the theoretical map 11. In the test device, only such chips that have passed the DC test and are defined as target chips for the high frequency test in the theoretical map undergo the high frequency test. COPYRIGHT: (C)2004,JPO
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