发明名称 Die assembly
摘要 A die assembly including a first die with a first die surface and a first cutting rib extending from the first die surface. The first cutting rib includes a first cutting surface parallel to the first die surface. The first cutting rib includes a leg extending from the first die surface to the first cutting surface at a first obtuse angle. A second die includes a second die surface and a second cutting rib extending from the second die surface. The second cutting rib includes a second cutting surface parallel to the second die surface. The second cutting surface is generally parallel to and defines a cutting overlap with the first cutting surface at a cross-section taken through the first and second dies in a cutting position. The cutting rib includes a leg extending from the second die surface to the second cutting surface at a second obtuse angle.
申请公布号 US2004045427(A1) 申请公布日期 2004.03.11
申请号 US20020241054 申请日期 2002.09.10
申请人 XYNATECH, INC. 发明人 KANG PIERSON S.
分类号 B26F1/44;B31B1/20;(IPC1-7):B26D11/00;B31B1/25;B26D3/08 主分类号 B26F1/44
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