发明名称 Low dielectric loss tangent resin composition, curable film and cured product, electrical part using the same and method for production thereof
摘要 According to the present invention, there is provided a low dielectric loss tangent resin composition containing a crosslinking component having a weight average molecular weight of not more than 1,000 and a plurality of styrene groups and represented by the formula [1], wherein R is a hydrocarbon skeleton which may have a substituent, R<1 >is hydrogen, methyl or ethyl, m is an integer of 1-4 and n is an integer of 2 or more, and further containing at least one member selected from a high polymer having a weight average molecular weight of not less than 5,000 and a filler, which resin composition can give a cured product having a good flexibility, high tensile strength and low dielectric constant and dielectric loss tangent.
申请公布号 US2004048965(A1) 申请公布日期 2004.03.11
申请号 US20030649950 申请日期 2003.08.28
申请人 AMOU SATORU;YAMADA SHINJI;ISHIKAWA TAKAO;MIWA TAKAO 发明人 AMOU SATORU;YAMADA SHINJI;ISHIKAWA TAKAO;MIWA TAKAO
分类号 C08J5/18;C08F2/40;C08F2/44;C08F4/00;C08F4/32;C08F12/08;C08F12/34;C08F212/14;C08F212/32;C08F257/02;C08F291/00;C08K5/01;H01B3/44;(IPC1-7):C08K3/26;C08K3/34;C08K3/40;C08K3/04 主分类号 C08J5/18
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