| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a positive type photosensitive composition which reduces the generation of development defects remarkably. <P>SOLUTION: The positive type resist composition includes (A) an oxime sulfonate compound, (B) a resin which has a specific structural unit, is decomposed by an action of an acid and has consequently its solubility in an alkaline developing liquid increased, and (C) a fluoro aliphatic containing polymeric compound. Thus, the positive type photoresist composition which reduces the generation of defects remarkably, is provided. <P>COPYRIGHT: (C)2004,JPO |
