METHOD FOR INSPECTING SEMICONDUCTOR PACKAGING STRUCTURE, SEMICONDUCTOR DEVICE PACKAGING STRUCTURE, ELECTRO-OPTICAL APPARATUS, AND ELECTRONIC APPARATUS

摘要

PROBLEM TO BE SOLVED: To provide a method for inspecting a semiconductor packaging structure and capable of easily grasping the degrees of locational deviations between a substrate and a semiconductor device in two different directions in the case that the semiconductor device is packaged to the substrate; a semiconductor device packaging structure; an electro-optical apparatus; and an electronic apparatus. SOLUTION: The substrate is provided with reference terminals 213A and 215A. The semiconductor device 230 is provided with corresponding reference electrodes 231A and 235A. The reference terminals 213A and 215A are formed in such a way as to be extended in an X direction, and their tip edges 213t and 215t are arranged within the widths of the reference electrodes 231A and 235A in the X direction. In other words, the tip edges 213t and 215t of the reference terminals 213A and 215A or their extended lines are planarly superposed on the reference electrodes 231A and 235A. COPYRIGHT: (C)2004,JPO