| 摘要 |
PROBLEM TO BE SOLVED: To prevent a second Ni-plating from blistering in a heat radiation member in a package manufactured by applying the Ni-plating a plurality of times after brazing a copper heat radiation member to a package body. SOLUTION: The thickness of a first nickel plating layer 31 is 1.5-2.5μm. Since the thickness of the first Ni-plating layer 31 is 1.5μm or more, a Cu-Ni alloy layer existing on its surface is less even if the copper of a heat radiation member 21 is dispersed to the first Ni-plating layer 31. Accordingly, blistering can be prevented since the deterioration of adhesion to the second Ni-plating layer 32 is less. The adhesion of the Ni-plating itself may not be deteriorated since the upper limit of the thickness of the first Ni-plating layer 31 is 2.5μm. COPYRIGHT: (C)2004,JPO |
