| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin filling device simplified in device structure, not high in manufacturing cost, and excellent in productivity. SOLUTION: A sliding body 12 that slides on the surface of a printed wiring board 40 is provided with an air suction aperture 13a connected to an evacuation unit 20 and with a resin feed aperture 14a accommodating a resin. A via-hole 41 is connected to the air suction aperture 13a for evacuation for production of a vacuum therein, and then is connected to the resin feed aperture 14a for filling a resin R. Since what is required is the production of a vacuum only in the via-hole 41, time for evacuation is shortened greatly. COPYRIGHT: (C)2004,JPO
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