| 摘要 |
PROBLEM TO BE SOLVED: To provide a space-saving type electroplating apparatus and an electroplating method by which copper plating can uniformly be applied to the whole of a stock face with satisfactory glossiness. SOLUTION: In the electroplating apparatus, a belt-like stock M is carried into an electroplating tank 6 in a vertical state, and electroplating is continuously performed. In the upper solution in the electroplating tank 6, cathode electrode plates 30 and 31 are disposed, which energize the stock face while contacted with the face of the belt-like stock M to be carried-in. As for the shapes of the cathode electrode plates 30 and 31, the faces in contact with the faces of the belt-like stock M are ruggedly formed, and they are intermittently contacted. COPYRIGHT: (C)2004,JPO
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