| 摘要 |
PROBLEM TO BE SOLVED: To provide a vapor deposition system capable of correctly measuring the evaporation rate of a film-forming material, highly precisely performing composition control and stably depositing even a thick film. SOLUTION: The vapor deposition system for depositing the film-forming material evaporated from at least two evaporation sources at the prescribed film thickness to an object for vapor deposition held in a vacuum vapor deposition chamber comprises: sensors which detect the vapor deposition rate of the deposition material and are arranged in correspondence to at least the two evaporation sources; shielding means which intermittently shield the sensors form the evaporated deposition material so as to intermittently stick the deposition material thereto and are arranged for at least one sensors; sneak preventing means which prevent the non-correspondent deposition material from sneaking to the sensors and are arranged for the at least one sensors not arranged with the shielding means; and a deposition control means which performs deposition in accordance with the vapor deposition rate of the deposition material detected by the sensors. COPYRIGHT: (C)2004,JPO
|
