发明名称 Multilayer ceramic electronic component, electronic component aggregate, and method for producing multilayer ceramic electronic component
摘要 A multilayer ceramic electronic component includes an electronic component body a notch formed in a side surface of the electronic component body, and a joining electrode formed by dividing a joining via hole conductor is formed at a portion of an inside surface defining the notch. A cover that is mounted to the electronic component body has a leg, with the leg of the cover being positioned inside the notch. By joining the leg to the joining electrode, the cover is secured to the electronic component body. The multilayer ceramic electronic component includes an LGA (land grid array) type external terminal electrode. The multilayer ceramic electronic component makes it possible to mount a cover for covering a mounted component without increasing the planar dimensions of the electronic component and without <custom-character file="US20040045655A1-20040311-P00999.TIF" wi="151.6" he="8.4" id="custom-character-00001" alt="text missing or illegible when filed"/>
申请公布号 US2004045655(A1) 申请公布日期 2004.03.11
申请号 US20030637632 申请日期 2003.08.11
申请人 MURATA MANUFACTURING CO., LTD. 发明人 SAKAI NORIO;KATO ISAO;NISHIDE MITSUYOSHI
分类号 H01G4/252;H01L23/04;H01L23/08;H01L23/10;H01L23/498;H05K1/09;H05K3/00;H05K3/34;H05K3/40;(IPC1-7):C03B29/00 主分类号 H01G4/252
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