发明名称 BONDING TOOL
摘要 <P>PROBLEM TO BE SOLVED: To stably measure the amplitude at the tip of a bonding tool during bonding operation with an ultrasonic wave horn, even if an ultrasonic wave vibration is applied in the direction vertical to a bonding surface. <P>SOLUTION: An ultrasonic wave vibrator system 26 press contacts a tip to an electronic component 4 for pressurizing, and generates ultrasonic wave vibration in the pressurizing direction. A through hole 16 is formed on the ultrasonic wave vibrator system 26 from its base end toward tip side. A laser vibration meter 17A radiates laser beam to the tip through the through hole 16 to observe a reflected light and measures the amplitude at the tip end of the ultrasonic wave vibrator system 26. <P>COPYRIGHT: (C)2004,JPO
申请公布号 JP2004079969(A) 申请公布日期 2004.03.11
申请号 JP20020242042 申请日期 2002.08.22
申请人 TOSHIBA CORP 发明人 AIZAWA TAKAHIRO;IKETANI YUKIHIRO;OTANI KAZUMI
分类号 H01L21/60;H01L21/607 主分类号 H01L21/60
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