| 摘要 |
PROBLEM TO BE SOLVED: To provide a multi-chip package which uses a paste material that can realize such dice bonding that never causes any tilting of chips. SOLUTION: On a first surface 3A of a lower side chip 3 out of stacked chips 3 and 4, a wooden clock tooth-like spacer 6 constituted of two sub-spacers 6A and 6B formed of polyimide or the like is arranged to form a constant space between the first surface 3A of the lower side chip 3 and a second surface 4B of the upper side chip 4. Due to this structure, the tilting of the upper side chip 4 can be prevented. COPYRIGHT: (C)2004,JPO
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