| 摘要 |
The invention concerns a method for making a solder between metallic balls forming part, or designed to form part, of a BGA or CSP type housing or the like and mounting lands belonging to a printed circuit deposited on a support or to an integrated circuit enclosed in said housing. The method consists in: deposition of a solder cream or an adhesive flow on said mounting lands; bringing said balls on said mounting lands; and introducing the assembly in a soldering furnace by remelting so as to bring the metallic balls above their melting temperature. Said method is characterised in that it consists afterwards in forced cooling of the support and/or of the housing by imposing on the balls a cooling rate of 5° C./s at least.
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