PROTECTIVE STRUCTURE OF SEMICONDUCTOR WAFER, METHOD FOR PROTECTING SEMICONDUCTOR WAFER, MULTILAYER PROTECTIVE SHEET USED THEREIN, AND METHOD FOR PROCESSING SEMICONDUCTOR WAFER

摘要

A protective structure of semiconductor wafer, in which a protective sheet (13) is provided on the circuit of a semiconductor wafer (5) and has an outer diameter larger than that of the semiconductor wafer. The protective structure of semiconductor wafer can prevent the wafer from fracturing during grinding in which the wafer is ground down very thin or during conveyance of the wafer. A method for protecting a semiconductor wafer and a multilayer protective sheet used in the structure are provided. A method for machining a semiconductor wafer wherein fracture of a wafer during application or removal of an adhesive sheet can be reduced is also disclosed.