METHOD OF REDUCING DEFECTS IN MANUFACTURING SEMICONDUCTOR DEVICE, AND PROCESSING SOLUTION

摘要

PROBLEM TO BE SOLVED: To provide a method by which defects of a semiconductor device generated in the manufacturing, a crushing of pattern in particular, are decreased without sacrificing a throughput, and to provide a processing solution for the method.

SOLUTION: The number of defects in the manufacturing of the semiconductor device is reduced by using the processing solution including one or more surfactants. The number of such defects after developing as the crushing of pattern is decreased by using the processing solution as a rinse liquid at the time of developing of a patterned host resist layer or thereafter under a specified preferable aspect.

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