| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and an apparatus for stably manufacturing a semiconductor at a high production speed which eliminate the need to measure the tilt of a 1ST chip 3 by a pressure sensor, etc., when a manufacturing method using a connection pedestal 4 where the 1ST chip 3 bonded to a die pad 2 in a lead frame 1 is mounted directly is employed and also eliminate tilt misadjustment due to mismeasurement, etc., to connect two chips. SOLUTION: In the method for manufacturing a CHIP ON CHIP structure which connects circuit surfaces of two chips to each other, the 1ST chip bonded to the die pad in the lead frame is mounted with the connection pedestal 4 which is shaped avoiding the die pad and on which the 1ST chip can be mounted directly, and a 2ND chip having a projection electrode for connection facedown is sucked by a bonding tool and connected to secure connection between the 1ST chip and the 2ND chip with high parallelism. COPYRIGHT: (C)2004,JPO
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