| 摘要 |
PROBLEM TO BE SOLVED: To solve such a problem that a conventional junction-down mounting type surface emission laser, where a substrate is opaque against laser light and the laser light is picked up from an opening made on the rear surface, suffers from low heat dissipation owing to the opening in the rear surface, and hence cannot sufficiently reduce thermal resistance. SOLUTION: The thickness of a semiconductor layer between an active layer and a light emitting surface is made to be 8μm or more, a heat produced in a light emission part can be dissipated through a route allowing the heat to directly flow from the light emission part to a heat sink, as well as a route allowing the heat to spread from the light emission part to the side of a substrate. Therefore, thermal resistance of a component can be reduced. COPYRIGHT: (C)2004,JPO
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