LASER PROCESSING METHOD AND DEVICE FOR SILICON SUBSTRATE, AND LASER CUTTING METHOD AND DEVICE FOR SILICON WIRING

摘要

PROBLEM TO BE SOLVED: To provide a laser processing device which is useful particularly for cutting short-circuited parts provided on silicon wiring, prevents the splash of molten silicon, is excellent in the accuracy of machining, and is capable of boring or cutting a silicon substrate efficiently.

SOLUTION: The laser processing device comprises a means of adjusting the surface roughness (Ra) of the silicon substrate to 0.05-1μm and a means of emitting laser beams.

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