| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device which of automatically corrects AC timing chip by chip after substrate packaging, and materializes the AC timing suitable for a packaging environment by enabling freely changing the AC timing after actual chip completion, and enables automatically correcting variable delay amount, and also to provide a system packaged with the semiconductor device. <P>SOLUTION: An LSI1 comprises a clock regenerating circuit 17 regenerating an inner clock signal by inputting a clock signal from the outside, an inputting/outputting circuit 12 inputting/outputting a data signal to the outside, and a phase adjusting circuit 18 adjusting a relative phase between the inner clock signal regenerated by the clock regenerating circuit 17 and the data signal inputted/outputted by the inputting/outputting circuit 12. A CPU 2 is connected to the outside of the LSI1, and the AC timing is freely changed even after actual chip completion between the LSI1 and the CPU2. In addition, variable delay amount is automatically corrected. <P>COPYRIGHT: (C)2004,JPO</p> |
