| 摘要 |
PROBLEM TO BE SOLVED: To provide a gas treatment device and a gas treatment method for uniformly feeding gas to a substrate to perform uniform gas treatment. SOLUTION: The gas treatment device 1 comprises a treatment vessel 2 to treat a wafer W by using treatment gas, a loading table 5 which is disposed in the treatment vessel 2 with the wafer W loaded thereon, a shower head 22 which is provided corresponding to the wafer W on the loading table 5 to discharge treatment gas into the treatment vessel 2, and an evacuating device to evacuate the treatment vessel 2. The shower head 22 has a first gas discharge hole 46 formed corresponding to the wafer W loaded on the loading table 5, and a second gas discharge hole 47 which is separate from the first gas discharge hole 46 and provided around the first gas discharge hole 46 to discharge the treatment gas to a peripheral part of the wafer W on the loading table 5. COPYRIGHT: (C)2004,JPO |
