| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition useful for coatings, ink, adhesives, molded articles, semiconductor sealing agents, solder resists, etc., and excellent in storage stability, etc. SOLUTION: The resin composition comprises a compound having a group represented by general formula (I) [wherein R<SP>1</SP>, R<SP>2</SP>and R<SP>3</SP>are same or different and each represents substituted or unsubstituted alkyl, substituted or unsubstituted aryl or substituted or unsubstituted aralkyl or R<SP>1</SP>and R<SP>2</SP>form a cycloalkyl together with an adjacent carbon atom or R<SP>2</SP>and R<SP>3</SP>form an oxygen-containing heterocyclic ring together with an adjacent C-C-O] and a compound having a functional group capable of forming a chemical bond with a carboxy group. COPYRIGHT: (C)2004,JPO
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