| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic circuit device wherein heat generated from an electronic component can be radiated in a saved space and at a low cost. SOLUTION: The electronic circuit device 1 is formed by laminating in sequence boards 3 and 7 where an electronic component 11 is mounted, and brackets 5 holding the boards 3 and 7. The bracket 5 is provided with a contact 13 that is in contact with the electronic component 11 mounted to the board 7 next to the board 3 where the bracket 5 is held, and heat generated from the electronic component 11 is conducted to the bracket 5 through the contact 13. COPYRIGHT: (C)2004,JPO
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