| 摘要 |
PROBLEM TO BE SOLVED: To provide a peeling mechanism capable of easily and forcefully peeling contact of an IC socket and a pad of an IC package stuck on together. SOLUTION: The IC socket comprises a socket main part, a cover which freely moves up and down on the socket main part through a spring, at least a pair of latches which open and close by a vertical movement of the cover, a floating plate which freely moves up and down on the socket main part through a spring and clips the IC package between itself and the latch, and a contact of which the contact part for contacting the pad of the IC package is arranged in the aperture provided on the floating plate and which electrically connects the IC package and the test board, and the latch has a push-up member for pushing up the floating plate. The above contact may be a pogo pin. COPYRIGHT: (C)2004,JPO
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