发明名称 Localized compression molding process for fabricating microstructures on thermoplastic substrates
摘要 This invention discloses a process for rapidly and economically replicating microstructures on polymeric substrates. During the process, a die with protruded microstructures is rapidly heated to above the polymer softening temperature, pressed onto a cold polymer substrate, and subsequently rapidly cooled for die separation. When the heated die contacts the polymer substrate, localized melting occurs at the contacting locations between the substrate and the to-be-replicated microstructure. The resulted melts are confined locally, forming localized spots for compression molding. Bulk deformation of these localized melts results in microstructure replication. In addition to reduction in cycle time, the new process improves dimensional accuracy of replicated microstructures due to uncoupling of microfabrication with macrofabrication.
申请公布号 US2004046281(A1) 申请公布日期 2004.03.11
申请号 US20020236799 申请日期 2002.09.06
申请人 KIM BYUNG;YAO DONGGANG 发明人 KIM BYUNG;YAO DONGGANG
分类号 B29C59/02;(IPC1-7):B29C33/02 主分类号 B29C59/02
代理机构 代理人
主权项
地址