| 摘要 |
A method of mounting a chip in which an underfill agent having specific viscosity behavior and a trigger temperature is applied to at least one of a substrate and the chip, bumps are press-contacted to electrodes, the underfill agent is spread around the press-contacted bumps and the electrodes between the chip and the substrate, the bumps are melted by heating while the bumps are embedded in the underfill agent to bond the molten bumps and the electrodes, and in melt-bonding the bumps, a time to wet-spread the molten bumps is kept before the underfill agent is cured. Highly reliable excellent bonding between the bumps and the electrodes can be achieved by thoroughly wet-spreading the molten bumps while secondary oxidation in the underfill agent does not occur, and the time required until the underfill agent is cured to a specified state, and further resultantly, the time required until the press of the chip is stopped can be shortened. By this method, drastic simplification of the mounting process in total and drastic shortening of the tact time are possible.
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