发明名称 |
Audio coding and decoding |
摘要 |
The present invention provides a circuit board in which peeling strength is prevented from decreasing and connection resistance to conductive material is prevented from increasing, though the contact area decreases when the circuit board has a copper foil. This circuit board has metal film (105) for covering a through hole on at least one surface of insulating substrate (101) having the through hole filled with conductive material (104). Uneven layer (1069 with a thickness of 5 mum or more is formed on a surface of metal film (105), and a metal layer is formed on the opposite surface to uneven layer (106).
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申请公布号 |
US2004045738(A1) |
申请公布日期 |
2004.03.11 |
申请号 |
US20030250871 |
申请日期 |
2003.07.09 |
申请人 |
SUGAWA TOSHIO;TAKASE YOSHIHISA |
发明人 |
SUGAWA TOSHIO;TAKASE YOSHIHISA |
分类号 |
H05K1/11;H05K1/03;H05K3/00;H05K3/06;H05K3/10;H05K3/18;H05K3/24;H05K3/38;H05K3/40;H05K3/46;(IPC1-7):H05K1/16 |
主分类号 |
H05K1/11 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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