| 摘要 |
A method for attaching an electronic component to a substrate (1) having a patterned conductive layer (3) underlying a dielectric layer includes : removing regions of the dielectric layer (2) to form cavities (6) having an exposed surface area of the conductive layer (3) ; filling the cavities (6) with solder paste ; heating the solder paste to form a convex surface which protrudes above the substrate surface, for receiving an electronic component for attachment ; planarising the convex surface such that it and the surface of the substrate surface are substantially coplanar ; placing contact pads of the electronic component adjacent the substrate (1) such that the contact pads overlie given filled cavities (6) ; and reheating the solder so that it reflows and connects the electronic component to the substrate. The cavities (6) preferably all have the same volume. If the ratio of exposed surface area to cavity volume is low, pillars form during reflow, spacing the component from the substrate. |
